Product Details
Features a 70-minute work life
Rigid potting compound is non-corrosive to copper
Minimal exotherm and very low shrinkage
Low-viscosity adhesive for easy dispensing and potting
Well-suited for potting and bonding electronic and electrical components
Flammability testing per UL94 HB
Specifications
- Format 1.7 fl. oz./48.5 ml
- Container Type Dual Cartridge
- Colour Clear
- Application Time 70 min.
- Full Cure Time 48 hrs.
- Type Two-Part
Additional Specifications
- Shear Strength 2500 PSI
- Storage Temperature 22°C (72°F)